July 2025

Minimizing the impact of temperature gradient on the accuracy of linear regulators

As integrated circuit (IC) power density increases and high-power burst applications emerge, circuit and layout designs must account for thermal behavior and heat dissipation. Proper matching of analog and mixed-signal components under high thermal conditions is crucial. This paper presents a voltage regulator in a Power-Over-Ethernet (POE) IC designed for high-power events. The regulator's thermal sensitivity and...

Author(s): Offer Schwartsglass, Shimon Cohen, and Gabriel Levhar